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Supermicro MBD-X12DPG-AR

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Product SKUs

  • MBD-X12DPG-AR

Physical Stats

  • Form Factor
    Proprietary
  • Dimension
    9.15″ x 19.8″ (23.24cm x 50.29cm)

Processor

  • CPU
    3rd Gen Intel Xeon Scalable processors
    Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
  • Core
    Up to 40 cores

System Memory

  • Memory Capacity
    16 DIMM slots
    Up to 4TB Intel Optane Persistent Memory 200 Series, DDR4-3200MT/s; Up to 6TB Intel Optane Persistent Memory 200 Series, DDR4-3200MT/s
    Up to 4TB 3DS ECC LRDIMM, DDR4-3200MT/s; Up to 4TB 3DS ECC RDIMM, DDR4-3200MT/s
  • Memory Type
    3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
  • DIMM Sizes
    LRDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
    RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
  • Memory Voltage
    1.2V
  • Error Detection
    Detects double-bit errors (using ECC memory)

On-Board Devices

  • Chipset
    Intel C621A
  • SATA
    Intel C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • IPMI
    ASPEED AST2600 BMC
  • Network Controllers

Input / Output

  • USB
    2 USB 3.2 Gen2 port(s) (2 rear)
  • Video Output
    1 VGA port(s)
  • Serial Port
    1 COM Port(s) (1 rear)
  • TPM
    1 TPM Header

Expansion Slots

  • PCIe
    1 PCIe 4.0 x8 AIOM,
    2 PCIe 4.0 x8,
    6 PCIe 4.0 x16
  • M.2
    M.2 Interface: 2 PCIe 3.0 x4
    Form Factor: 2280/22110
    Key: M-Key
    M.2 supported through M.2 carrier board

System BIOS

  • BIOS Type
    AMI UEFI

Management

  • System Management Software
    IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
  • Power Configurations
    ACPI / ACPM Power Management
TPM

1 TPM Header

M.2

M.2 Interface: 2 PCIe 3.0 x4Form Factor: 2280/22110Key: M-Key

Chipset

Intel C621A

DIMM Sizes

128GB, 256GB, 256GBRDIMM: 16GB, 32GB, 64GB, LRDIMM: 16GB

BIOS Type

AMI UEFI

Video Output

1 VGA port(s)

Dimension

9.15" x 19.8" (23.24cm x 50.29cm)

PCIe

1 PCIe 4.0 x8 AIOM, 2 PCIe 4.0 x8, 6 PCIe 4.0 x16

USB

2 USB 3.2 Gen2 port(s) (2 rear)

Form Factor

Proprietary

Memory Type

3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)

Application

Server

IPMI

ASPEED AST2600 BMC

Memory Voltage

1.2V

CPU

3 UPI up to 11.2 GT/s, 3rd Gen Intel Xeon Scalable processorsDual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP

Hardware

Trusted Platform Module (TPM) 2.0

Serial Port

1 COM Port(s) (1 rear)

SATA

1, 10, 5, Intel C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0

Memory Capacity

16 DIMM slotsUp to 4TB Intel Optane Persistent Memory 200 Series, DDR4-3200MT/s, DDR4-3200MT/s; Up to 4TB 3DS ECC RDIMM, DDR4-3200MT/s; Up to 6TB Intel Optane Persistent Memory 200 Series, DDR4-3200MT/sUp to 4TB 3DS ECC LRDIMM

Error Detection

Detects double-bit errors (using ECC memory)

Core

Up to 40 cores

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